TapTechNews August 27th news, at the beginning of 2023, Samsung Electronics hired Lin Juncheng, the former deputy R & D director of TSMC, as the vice president of the advanced packaging business group of the semiconductor department. According to Taiwan media Digitimes, semiconductor practitioners revealed that the advanced packaging business group of Samsung has been dissolved, and it is now rumored that the semiconductor wafer factory in the Chinese mainland has beckoned to Lin Juncheng, and the subsequent trend is of great concern.
Lin Juncheng joined TSMC in 1999 and was a member of the CoWoS/InFO-PoP R & D team. In 2018, he moved to Micron and served as the senior director and R & D head in Taiwan, China, responsible for the development of 3DIC advanced packaging technology.
Later, Lin Juncheng transferred to the semiconductor equipment manufacturer Tianhong in the second half of 2019; after the 3-year contract with Tianhong expired, Lin Juncheng moved to Samsung in 2023, signed a 2-year work contract, and led the TaskForce team.
But semiconductor practitioners revealed that this TaskForce team that shoulders the task of countering TSMC has been dissolved, and the relevant personnel returned to the semiconductor, advanced process, advanced packaging and other departments. At the same time, Lin Juncheng's 2-year contract with Samsung is about to expire, and Samsung tends not to renew it.
Samsung only said that the TaskForce has indeed been dissolved, mainly due to the adjustment of Samsung's own organization, and did not respond to the relevant personnel.
TapTechNews noted that in the report, semiconductor practitioners commented that Lin Juncheng's R & D ability is actually quite good, but the overall influence still has a considerable gap compared to Liang Mengsong who shines in advanced processes. He has left TSMC for several years, and he can't grasp the advancement of advanced packaging R & D technology, and he can't recruit talents from TSMC. Coupled with the growing gap between Samsung's advanced processes and TSMC, even Lin Juncheng, who has more than 500 semiconductor patents, it is difficult for one person to make Samsung's advanced packaging technology quickly surpass TSMC.