xMEMS Releases XMC-2400 μCooling Chip for Mobile Devices
TapTechNews August 21, local time yesterday, MEMS microelectromechanical systems enterprise xMEMS released the XMC-2400 μCooling active microfan cooling chip. The cooling unit is based on an all-silicon device with a thickness of only 0.0425 inches.
xMEMS XMC-2400 has a package size of 0.364×0.299×0.0425 (inches), and weighs less than 0.0529 ounces, which is 4% of the weight of non-silicon-based active cooling. The tiny volume and extremely light weight enable the XMC-2400 to provide much-needed cooling capacity for lightweight end-side AI devices such as smartphones.
XMC-2400 cooling chip contains 4 groups of 8 units in total, with ventilation openings on the sides and top, which can move 39 cm3 of air per second under a back pressure of 1000 Pa (TapTechNews note: approximately 0.08264 CFM).
In addition, due to the nature of its all-silicon solution, the XMC-2400 has good reliability and supports IP58 dustproof and waterproof.
Joseph Jiang, CEO and co-founder of xMEMS, said:
Our revolutionary µCooling fan on a chip design comes at a critical moment in mobile computing: Ultra-portable devices are beginning to run more processor-intensive artificial intelligence applications, and thermal management is a huge challenge for both manufacturers and consumers.
And before the XMC-2400, there has been no active cooling solution because these devices are too small and too thin.
xMEMS plans to provide samples of the XMC-2400 to customers in the first quarter of 2025.