TSMC to Expand special process capacity by 50%

TapTechNews May 17th news, according to foreign media Anandtech report, TSMC said at the 2024 European Technology Forum held recently that it plans to expand its special process capacity by 50% in the future to enhance the resilience of the semiconductor supply chain.

In addition to the standard process, TSMC can also provide a series of special process/technology foundry services, including:

MEMS sensor SoC process, CIS technology for CMOS image sensors, embedded non-volatile memory (eNVM), hybrid/RF products, analog chips, high-voltage semiconductors, BCD power ICs and ultra-low power (ULP) devices.

Zhang Xiaoqiang, the deputy co-COO in charge of international business of TSMC, said that TSMC has recently started to build new wafer fabs specifically for special processes again, and will increase the special process capacity by 50% in the next four to five years to expand the scale of the overall semiconductor foundry network.

According to TapTechNews' previous reports, TSMC's most advanced process in the ultra-low power consumption field at present is N6e. As a 7nm variant node, N6e supports a working voltage of 0.4 to 0.9V and is expected to start production this year;

Looking to the future, TSMC will also add the N4e node to the 5nm family and is considering a working voltage lower than 0.4V.