TapTechNews reported on June 24th that according to Taiwan media outlet 'Economic Daily' report today, after TSMC exclusively manufactured AI chips for tech giants such as NVIDIA and AMD, the market recently spread that it teamed up with its subsidiary Creativity Electronics to obtain a large order for the next-generation key basic interface chip for HBM4.
Corporations pointed out that currently, the demand for AI is strong, and the related demands of High-Performance Computing (HPC) and High Bandwidth Memory (HBM) have become extremely popular, becoming a new business opportunity in the market, attracting the three major memory chip makers (TapTechNews note: SK Hynix, Samsung, Micron) to actively invest. Currently, the HBM3/HBM3e and other HBM production capacities are in short supply.
Due to the capacity and speed limitations of the existing HBM3/HBM3e, there is a risk that the new generation of AI chips cannot exert their maximum computing power. All three major factories unanimously increased capital expenditures and started to invest in the research and development of the next-generation product HBM4, aiming to mass-produce by the end of 2025 and ship in large quantities in 2026.
On the other hand, SK Hynix has announced to sprint for the HBM4 and advanced packaging business opportunities with TSMC. The industry pointed out that Creativity has already won the order of SK Hynix's HBM4 chip commissioned design case. It is expected that the design will be finalized最快明年, and it will be produced using TSMC's 12-nanometer and 5-nanometer processes according to different needs such as high performance or low power consumption. It is expected that the commissioned design (NRE) opening cases in the second half of the year will significantly contribute to revenue and rush into the HBM supply chain.