Nippon Electric Glass Unveils New Semiconductor Substrate Material GCCore
TapTechNews June 12th news, Nippon Electric Glass recently announced the launch of a new semiconductor substrate material GC (TapTechNews note: that is Glass-Ceramics).
Compared to organic substrates, glass substrates are stronger, have a smoother surface, and are more convenient for carrying ultra-fine circuits, which is a star technology in the advanced packaging field. A series of important semiconductor enterprises such as Intel and Samsung have all made efforts in this direction.
However, the brittleness of the glass material itself also limits the application of glass substrates to a certain extent:
The biggest advantage of glass substrates is that they support the construction of TGV (Through Glass Via) vertical channels, but when using the common CO2 laser to drill holes on the glass substrate at present, cracks are prone to occur, which may eventually lead to substrate rupture.
If you want to avoid this problem, you need to switch to laser modification and etching treatment for drilling. This solution is not only more troublesome technologically, but also introduces additional expenses.
Nippon Electric Glass has developed the GCCore substrate core material this time, which is formed by low-temperature co-firing of glass powder and ceramic powder. It has some properties of ceramics, is not easy to produce cracks, and can directly drill holes with a CO2 laser to reduce mass production costs.
Not only that, the substrate using GCCore material has a lower dielectric constant and polarization loss, which can reduce the signal attenuation of ultra-fine circuits and improve the circuit signal quality.
In addition, Nippon Electric Glass's GCCore substrate is stronger than traditional glass substrates and can further reduce the thickness of the substrate.
By adjusting the ratio of glass powder to ceramic powder, Nippon Electric Glass can customize the GCCore substrate according to the needs of semiconductor customers. At present, it can produce three types of products: standard low dielectric constant type, high thermal expansion coefficient type and high mechanical strength type.
Nippon Electric Glass said that the company has successfully produced a 300*300mm square GCCore substrate, and the goal is to expand this size to 510*510mm by the end of 2024.