TapTechNews网友华南吴彦祖 provided a clue! Alpha Biz reported that Samsung Electronics' 8-layer stacked (8Hi) HBM3E memory has not yet passed Nvidia's tests and further verification is needed. TSMC not only provides advanced AIGPU for Nvidia, but also is responsible for the advanced CoWoS packaging between AIGPU and HBM memory, making it an important participant in Nvidia's verification process. A source familiar with the supply relationship between Samsung Electronics and Nvidia told the Korean media that Samsung Electronics' 8Hi HBM3E verification process is stuck in TSMC's approval process. The source claimed that the main reason Samsung's product failed the test was that TSMC used a testing standard based on SK Hynix's HBM3E product settings. There are many differences between Samsung Electronics and SK Hynix in the process of HBM3E memory, such as the former using TC-NCF (thermocompression non-conductive film) bonding, and the latter using MR-RUF (mass reflow underfill). This will inevitably affect the parameters to some extent. The source believes that if the testing standard for Samsung Electronics' products is adjusted, Samsung's HBM3E memory passing Nvidia's supply test would not be a problem. Samsung Electronics previously stated that its 8Hi HBM3E memory entered mass production stage last month, and 12Hi HBM3E mass production will also be achieved this quarter.