#packaging#

Apple Expands Cooperation with TSMC on SoIC Packaging, Expected to Use in 2025
Apple and TSMC's cooperation in SoIC packaging, its details and differences from CoWoS, with expected applications. Less than 150 characters.
Emma·

Rapidus and IBM to Collaborate on 2nm Chiplet Packaging Technology
Rapidus in Japan to work with IBM on advanced semiconductor packaging technology for HPC systems.
Maxwell·

US Semiconductor Industry Developments
Report on the current situation and future trends of the US semiconductor industry and its supply chain, with a focus on the development of the advanced packaging ecosystem.
Maxwell·