#Rapidus#

Rapidus in Japan to work with IBM on advanced semiconductor packaging technology for HPC systems.

Japan's government plans to finalize a policy on semiconductors in late June, including measures for next-gen production. Also aims for autonomous driving plan by 2025.

Rapidus' first-generation process won't use High-NA EUV lithography, and its plans for 2nm and 1.4nm, as well as its market share prospects.

The progress of Rapidus' wafer factory project in Japan and its significance, with government support and future plans.

Japanese company Rapidus and US company Esperanto are partnering to develop low-power AI chips for data centers, aiming to address the growing electricity consumption in the global data center industry driven by AI applications.