#2nm#

Rapidus and IBM to Collaborate on 2nm Chiplet Packaging Technology
Rapidus in Japan to work with IBM on advanced semiconductor packaging technology for HPC systems.
Maxwell·

Rapidus' Process and Future Plans
Rapidus' first-generation process won't use High-NA EUV lithography, and its plans for 2nm and 1.4nm, as well as its market share prospects.
Sophia·