Winbond Electronics' Developments in Memory and Storage

TapTechNews August 6th news, according to comprehensive Taiwan media MoneyDJ financial website and Jumei website reports, the general manager of niche memory enterprise Winbond Electronics, Chen Peiming, said at the corporate briefing on August 2 that its 4Gb capacity DDR4/LPDDR4 memory products have been shipping in large quantities.

Chen Peiming stated that due to factors such as the increase in unit price, Winbond Electronics achieved DRAM performance growth in the second quarter; while the decrease in the memory bit shipment volume is because customers in the Wi-Fi field have shifted from DDR3 to DDR4, affecting Winbond's DDR3 sales, but this trend also means that Winbond has sufficient demand for DDR4.

In the DRAM process part, Winbond's currently most advanced process is the 20nm-level D20, and the yield of this process has now reached more than 90%, and the relevant capacity of the Kaohsiung factory has reached 15,000 wafers per month.

Winbond Electronics plans to launch a more advanced 16nm DRAM process next year, striving to become the top of the second echelon after the three giants Samsung Electronics, SK Hynix, and Micron.

In the storage business part, Winbond Electronics has consecutively topped the global NOR flash memory for three years, and the new-generation 45nm NOR flash memory also started shipping in July. Considering that the NOR usage of AI servers has increased significantly compared to traditional servers, and the NOR demand in TWS earphones and smartphones is strong, the related business fundamentals are positive.

According to Winbond Electronics' official website, the company's total revenue in the first half of 2024 was 41.605 billion New Taiwan dollars (TapTechNews note: currently about 9.099 billion Chinese yuan), an increase of 14.5% year-on-year, and the net profit attributable to the parent company was 1.259 billion New Taiwan dollars, and the net profit per share was 0.3 New Taiwan dollars.