#advanced process#

TSMC to hike prices for advanced process and packaging; Nvidia makes concession

TSMC will increase prices for 3/5nm process and packaging. Nvidia agrees to give profit to get more capacity. Capacity gap in advanced packaging. High demand for TSMC.

DRAM Industry Update Capacity Expansion and Future Trends

Report on the latest developments in the DRAM industry, including capacity expansion plans of the three major factories and the potential shortage of DRAM products.

Apple's Visit to TSMC and Future Plans

Apple's COO visited TSMC to discuss AI chip development and more, with plans for future processors.
Jack·