#chip packaging#

AMD and Other Chip Makers' Move Toward FOPLP Packaging
This news reports on AMD and other companies' exploration of FOPLP packaging, its advantages, models, challenges, and impact on the industry.
Sophia·

Samsung Leads in Semiconductor Packaging, Ahead of TSMC in PLP
Samsung Electronics makes progress in semiconductor packaging and leads in PLP field. TSMC's related research and challenges are detailed. Less than 150 characters.
Emma·

TSMC Researching New Chip Packaging Method
TSMC is exploring a new advanced chip packaging approach using a rectangular substrate. Report on the details and challenges. 150 characters max.
Jack·